Stacking sequences for extensionally isotropic, fully isotropic and quasi-homogeneous orthotropic laminates

York, C.B. (2008) Stacking sequences for extensionally isotropic, fully isotropic and quasi-homogeneous orthotropic laminates. In: 49th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, Schaumburg, IL, USA, 7-10 Apr 2008, (doi:10.2514/6.2008-1940)

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Publisher's URL: http://dx.doi.org/10.2514/6.2008-1940

Abstract

Stacking sequence listings are presented for fully uncoupled Extensionally Isotropic (EILs), Fully Isotropic (FILs) and Quasi-Homogeneous Orthotropic (QHOLs) angle-ply Laminates, with up to 21 plies. All are sub-sets of a definitive list of Fully Orthotropic Laminates (FOLs), containing generally non-symmetric stacking sequences that are characterized in terms of angle- and cross-ply sub-sequence symmetries. Dimensionless parameters are given for each stacking sequence, from which the ABD matrix is readily derived. Expressions relating these dimensionless parameters to the well-known lamination parameters are also given, together with graphical representations of the feasible domains for Pi/3 and Pi/4 EILs and angle-ply QHOLs containing two and three ply orientations. The feasible domain for Pi/3 FILs is represented graphically by a single point, whereas the domain for angle-ply QHOLs containing four ply orientations is represented by a single stacking sequence.

Item Type:Conference Proceedings
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:York, Dr Christopher
Authors: York, C.B.
Subjects:T Technology > T Technology (General)
College/School:College of Science and Engineering > School of Engineering > Aerospace Sciences
University Centres > Glasgow Materials Research Initiative
Publisher:American Institute of Aeronautics and Astronautics
Copyright Holders:Copyright © 2008 The Author
First Published:First published in the Proceedings of the 49th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference
Publisher Policy:Reproduced with permission of the author

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