Devices and fabrication technology

Thayne, I. G. , Elgaid, K. and Ternent, G. (2001) Devices and fabrication technology. In: Robertson, I. D. and Lucyszyn, S. (eds.) RFIC and MMIC Design and Technology. Series: IEE circuits, devices and systems series (13). IEE Press: London, UK, pp. 31-81. ISBN 9780852967867 (doi:Devices and fabrication technology)

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Abstract

Advances in integrated circuit technology are the key to opening and fully exploiting new market opportunities, as exemplified recently by the massive expansion of the mobile phone sector in the telecommunications arena. The success of mobile communications is fundamentally underpinned by advances in semiconductor manufacturing technology. These have delivered key high performance components in large volume and with high yield, resulting in low unit costs. Today, the RF circuit designer has a greater choice in technology than ever before with the availability of internal corporate and external foundries offering silicon and III-V semiconductor bipolar and field effect device processes. The choice of technology ultimately depends on the application area and the component specifications. In this chapter, the wide range of active and passive device technologies utilised in contemporary MMIC realisation are reviewed, and key RF performance parameters such as bandwidth, gain, noise, power handling and linearity are compared.

Item Type:Book Sections
Status:Published
Glasgow Author(s) Enlighten ID:Thayne, Professor Iain and Ternent, Dr Gary and Elgaid, Dr Khaled
Authors: Thayne, I. G., Elgaid, K., and Ternent, G.
Subjects:T Technology > TK Electrical engineering. Electronics Nuclear engineering
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Publisher:IEE Press
ISBN:9780852967867

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