3D-printed elastomer foam-based soft capacitive pressure sensors

Karagiorgis, X., Ntagios, M. , Skabara, P. and Dahiya, R. (2022) 3D-printed elastomer foam-based soft capacitive pressure sensors. In: 2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Vienna, Austria, 10-13 July 2022, ISBN 9781665442732 (doi: 10.1109/FLEPS53764.2022.9781553)

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Abstract

The field of tactile sensing has exploded in recent years with the development of sensors using a wide variety of composite materials and fabrication techniques to meet the varying requirement of applications such as robotics, wearable, and interactive systems. Often these applications require touch sensors over large areas, and this calls for a simple manufacturing route such as additive manufacturing. Herein we present fully 3D printed highly sensitive capacitive touch sensors with an elastomeric foam-based dielectric layer (a blend of PDMS and BaTiO3) and PEDOT: PSS and AgNWs composite based electrodes. The device is encapsulated with PDMS. The sensor was tested under dynamic and static conditions, and the sensitivity was found to be 0.918 %kPa-1 with excellent linearity (99.77%). The presented approach for realizing soft and flexible electronic skin (e-Skin) in one single automated step has potential to transform applications such as wearables, health monitoring, and rehabilitation with low-cost and easily manufacturable high-performance sensors.

Item Type:Conference Proceedings
Additional Information:This work was supported in part by the Engineering and Physical Sciences Research Council through Engineering Fellowship for Growth (EP/R029644/1) and Heteroprint Programme Grant (EP/R03480X/1).
Keywords:tactile sensor, flexible sensors, soft sensor, porous PDMS, direct ink writing, 3D printing
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Ntagios, Markellos and Karagiorgis, Xenofon and Skabara, Professor Peter and Dahiya, Professor Ravinder
Authors: Karagiorgis, X., Ntagios, M., Skabara, P., and Dahiya, R.
Subjects:Q Science > QD Chemistry
T Technology > TA Engineering (General). Civil engineering (General)
College/School:College of Science and Engineering
College of Science and Engineering > School of Chemistry
College of Science and Engineering > School of Engineering
College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
ISBN:9781665442732
Published Online:10 June 2022
Copyright Holders:Copyright © 2022 IEEE
Publisher Policy:Reproduced in accordance with the publisher copyright policy
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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
301728Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering and Physical Sciences Research Council (EPSRC)EP/R029644/1ENG - Electronics & Nanoscale Engineering
301327`Hetero-print: A holistic approach to transfer-printing for heterogeneous integration in manufacturingPeter SkabaraEngineering and Physical Sciences Research Council (EPSRC)EP/R03480X/1ENG - Electronics & Nanoscale Engineering