Karagiorgis, X., Ntagios, M. , Skabara, P. and Dahiya, R. (2022) 3D-printed elastomer foam-based soft capacitive pressure sensors. In: 2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Vienna, Austria, 10-13 Jul 2022, ISBN 9781665442732 (doi: 10.1109/FLEPS53764.2022.9781553)
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Abstract
The field of tactile sensing has exploded in recent years with the development of sensors using a wide variety of composite materials and fabrication techniques to meet the varying requirement of applications such as robotics, wearable, and interactive systems. Often these applications require touch sensors over large areas, and this calls for a simple manufacturing route such as additive manufacturing. Herein we present fully 3D printed highly sensitive capacitive touch sensors with an elastomeric foam-based dielectric layer (a blend of PDMS and BaTiO3) and PEDOT: PSS and AgNWs composite based electrodes. The device is encapsulated with PDMS. The sensor was tested under dynamic and static conditions, and the sensitivity was found to be 0.918 %kPa-1 with excellent linearity (99.77%). The presented approach for realizing soft and flexible electronic skin (e-Skin) in one single automated step has potential to transform applications such as wearables, health monitoring, and rehabilitation with low-cost and easily manufacturable high-performance sensors.
| Item Type: | Conference Proceedings |
|---|---|
| Additional Information: | This work was supported in part by the Engineering and Physical Sciences Research Council through Engineering Fellowship for Growth (EP/R029644/1) and Heteroprint Programme Grant (EP/R03480X/1). |
| Keywords: | tactile sensor, flexible sensors, soft sensor, porous PDMS, direct ink writing, 3D printing |
| Status: | Published |
| Refereed: | Yes |
| Glasgow Author(s) Enlighten ID: | Karagiorgis, Xenofon and Dahiya, Professor Ravinder and Skabara, Professor Peter and Ntagios, Markellos |
| Authors: | Karagiorgis, X., Ntagios, M., Skabara, P., and Dahiya, R. |
| Subjects: | Q Science > QD Chemistry T Technology > TA Engineering (General). Civil engineering (General) |
| College/School: | College of Science and Engineering > School of Chemistry College of Science and Engineering > School of Engineering College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering |
| ISBN: | 9781665442732 |
| Published Online: | 10 June 2022 |
| Copyright Holders: | Copyright © 2022 IEEE |
| First Published: | First published in 2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) |
| Publisher Policy: | Reproduced in accordance with the publisher copyright policy |
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