PMMA sacrificial layer based reliable debonding of ultra-thin chips after lapping

Kumaresan, Y. , Ma, S. and Dahiya, R. (2021) PMMA sacrificial layer based reliable debonding of ultra-thin chips after lapping. Microelectronic Engineering, 247, 111588. (doi: 10.1016/j.mee.2021.111588)

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Abstract

Ultra-thin chips (UTCs) are needed to meet the performance and packaging related requirements of flexible electronics and 3D integrated circuits (ICs). However, handling of UTCs (<50 μm thick), particularly after thinning, is a challenging task as the excessive mechanical stresses could lead to cracking. Such damages could be prevented by restricting the stresses to acceptable levels. Herein, we present a new reliable and cost-effective method based on a polymethylmethacrylate (PMMA) sacrificial layer (20 μm-thick). The PMMA layer results in 4 order of magnitude lower stress on UTCs and, as a result, the reliable removal or debonding of UTCs (35 μm-thick) from the glass substrate has been achieved. The distinctive features of the presented method are high reliability and cost-effectiveness (an order of magnitude cheaper) with respect to conventional methods that use UV curable tapes. The UTCs with metal-oxide-semiconductor capacitors (MOSCAPs) devices were also obtained using this approach and were evaluated under different bending conditions. The stable and uniform performance (134 pF) observed under bending conditions demonstrates that the presented technique could be useful for integration of high-performance flexible UTCs on flexible printed circuit boards for various practical application.

Item Type:Articles
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Dahiya, Professor Ravinder and Ma, Sihang and Kumaresan, Dr Yogeenth
Authors: Kumaresan, Y., Ma, S., and Dahiya, R.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:Microelectronic Engineering
Publisher:Elsevier
ISSN:0167-9317
ISSN (Online):1873-5568
Published Online:29 June 2021
Copyright Holders:Copyright © 2021 The Authors
First Published:First published in Microelectronic Engineering 247: 111588
Publisher Policy:Reproduced under a Creative Commons License

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
304237Predictive Haptic COding Devices In Next Generation interfacesRavinder DahiyaEuropean Commission (EC)829186ENG - Electronics & Nanoscale Engineering
301728Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering and Physical Sciences Research Council (EPSRC)EP/R029644/1ENG - Electronics & Nanoscale Engineering
170185Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering and Physical Sciences Research Council (EPSRC)EP/M002527/1ENG - Electronics & Nanoscale Engineering