Automated nanoscale absolute accuracy alignment system for transfer printing

McPhillimy, J. , Jevtics, D., Guilhabert, B. J. E., Klitis, C. , Hurtado, A., Sorel, M. , Dawson, M. D. and Strain, M. J. (2020) Automated nanoscale absolute accuracy alignment system for transfer printing. ACS Applied Nano Materials, 3(10), pp. 10326-10332. (doi: 10.1021/acsanm.0c02224) (PMID:33134883) (PMCID:PMC7590505)

Abstract

The heterogeneous integration of micro- and nanoscale devices with on-chip circuits and waveguide platforms is a key enabling technology, with wide-ranging applications in areas including telecommunications, quantum information processing, and sensing. Pick and place integration with absolute positional accuracy at the nanoscale has been previously demonstrated for single proof-of-principle devices. However, to enable scaling of this technology for realization of multielement systems or high throughput manufacturing, the integration process must be compatible with automation while retaining nanoscale accuracy. In this work, an automated transfer printing process is realized by using a simple optical microscope, computer vision, and high accuracy translational stage system. Automatic alignment using a cross-correlation image processing method demonstrates absolute positional accuracy of transfer with an average offset of <40 nm (3σ < 390 nm) for serial device integration of both thin film silicon membranes and single nanowire devices. Parallel transfer of devices across a 2 × 2 mm2 area is demonstrated with an average offset of <30 nm (3σ < 705 nm). Rotational accuracy better than 45 mrad is achieved for all device variants. Devices can be selected and placed with high accuracy on a target substrate, both from lithographically defined positions on their native substrate or from a randomly distributed population. These demonstrations pave the way for future scalable manufacturing of heterogeneously integrated chip systems.

• Item Type: Articles
• Additional Information: We acknowledge the support of EPSRC (EP/P013570/1, EP/P013597/1, EP/R03480X/1, EP/L021129/1).
• Status: Published
• Refereed: Yes
• Glasgow Author(s) Enlighten ID: McPhillimy, Dr John and Klitis, Dr Charalambos and Sorel, Professor Marc
• Authors: McPhillimy, J., Jevtics, D., Guilhabert, B. J. E., Klitis, C., Hurtado, A., Sorel, M., Dawson, M. D., and Strain, M. J.
• Subjects: Q Science > QC Physics; T Technology > TK Electrical engineering. Electronics Nuclear engineering
• College/School: College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
• Journal Name: ACS Applied Nano Materials
• Publisher: American Chemical Society
• ISSN: 2574-0970
• ISSN (Online): 2574-0970
• Published Online: 01 October 2020
• Copyright Holders: Copyright © 2020 American Chemical Society
• First Published: First published in ACS Applied Nano Materials 3(10): 10326-10332
• Publisher Policy: Reproduced under a Creative Commons License

Project Code	Award No	Project Name	Principal Investigator	Funder's Name	Funder Ref	Lead Dept
174169		Parallel Heterogeneous Integration of III-V Devices on Silicon Photonic Chips	Marc Sorel	Engineering and Physical Sciences Research Council (EPSRC)	EP/P013570/1	ENG - Electronics & Nanoscale Engineering
301327		`Hetero-print: A holistic approach to transfer-printing for heterogeneous integration in manufacturing	Peter Skabara	Engineering and Physical Sciences Research Council (EPSRC)	EP/R03480X/1	ENG - Electronics & Nanoscale Engineering
170847		CORNERSTONE: Capability for OptoelectRoNics, mEtamateRialS, nanoTechnOlogy aNd sEnsing	Marc Sorel	Engineering and Physical Sciences Research Council (EPSRC)	EP/L021129/1	ENG - Electronics & Nanoscale Engineering