Encapsulated Magnetoelectric Composites for Wirelessly Powered Brain Implantable Devices

McGlynn, E., Das, R. and Heidari, H. (2020) Encapsulated Magnetoelectric Composites for Wirelessly Powered Brain Implantable Devices. In: 2020 27th IEEE International Conference on Electronics, Circuits and Systems (ICECS), Glasgow, Scotland, 23-25 Nov 2020, ISBN 9781728160443 (doi: 10.1109/ICECS49266.2020.9294847)

[img] Text
223331.pdf - Accepted Version

1MB

Abstract

Magnetoelectric devices are readily employed as sensors, actuators, and antennas, but typically exhibit low power output. This paper presents considerations for the viability of magnetoelectric composites for wireless power transfer in neural implantation. This is accomplished herein by studying different types of biocompatible encapsulants for magnetoelectric devices, their impact on the output voltage of the composites, and the rigidity of the materials in the context of tissue damage. Simulation results indicate that a polymer encapsulant, rather than creating a substrate clamping effect, increases the voltage output of the magnetoelectric, which can be further improved by careful polymer selection. These attributes are modelled using the finite element method (FEM) with COMSOL Multiphysics. The addition of a 0.2 mm poly(ethyl acrylate) encapsulating layer increases the piezoelectric voltage to 3.77 V AC output at a magnetic field strength of 200 Oe, as the magnetostrictive layer deforms inside the flexible outer polymer. Comparing voltage conditioning circuits, the output is sufficient for low-voltage neuronal stimulation when employing a simple bridge rectifier which boasts minimal charging time and ripple voltage around 1 mV.

Item Type:Conference Proceedings
Additional Information:Eve McGlynn is supported by the Engineering and Physical Sciences Research Council (EPSRC), under grant No. 2279645.
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:McGlynn, Eve and Heidari, Dr Hadi and Das, Dr Rupam
Authors: McGlynn, E., Das, R., and Heidari, H.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
ISBN:9781728160443
Copyright Holders:Copyright © 2020 IEEE
First Published:First published in 2020 27th IEEE International Conference on Electronics, Circuits and Systems (ICECS)
Publisher Policy:Reproduced in accordance with the publisher copyright policy
Related URLs:

University Staff: Request a correction | Enlighten Editors: Update this record