Galeote-Checa, G., Nabaei, V. , Das, R. and Heidari, H. (2020) Wirelessly Powered and Modular Flexible Implantable Device. In: 2020 27th IEEE International Conference on Electronics, Circuits and Systems (ICECS), Glasgow, Scotland, 23-25 Nov 2020, ISBN 9781728160450 (doi: 10.1109/ICECS49266.2020.9294856)
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Abstract
State-of-the-art advances in battery-free and flexible implants require new materials and devices for brain behavior recording and stimulation where the constraints in terms of mechanical and electrical matching are crucial. Wireless Power Transfer based neural implants consist of receiver antenna, power management circuit, and shank for power transmission, recording and stimulation. Here, the implementation of a novel implantable device fabricated on a flexible polyimide substrate and a modular approach to implant device typology is introduced. A flexible substrate of polyimide is chosen to provide better implant-brain tissue mechanical, biocompatibility and biointegration compliance. Both, electrical and mechanical analysis are provided to prove the correct operation of the fabricated device under the modelled environment. COMSOL Multiphysics mechanical modelling in implantation case is carried out to analyze the optimal shape and material choice.
Item Type: | Conference Proceedings |
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Status: | Published |
Refereed: | Yes |
Glasgow Author(s) Enlighten ID: | Das, Dr Rupam and Nabaei, Dr Vahid and Heidari, Professor Hadi |
Authors: | Galeote-Checa, G., Nabaei, V., Das, R., and Heidari, H. |
College/School: | College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering |
ISBN: | 9781728160450 |
Copyright Holders: | Copyright © 2020 IEEE |
Publisher Policy: | Reproduced in accordance with the copyright policy of the publisher |
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