A Horizontal Hall Sensor 3D COMSOL Model

Fan, H., Li, S., Cen, Y., Feng, Q. and Heidari, H. (2020) A Horizontal Hall Sensor 3D COMSOL Model. In: 2020 IEEE 63rd International Midwest Symposium on Circuits and Systems (MWSCAS), Springfield, MA, USA, 09-12 Aug 2020, ISBN 9781728180588 (doi:10.1109/MWSCAS48704.2020.9184586)

[img]
Preview
Text
220151.pdf - Accepted Version

915kB

Abstract

This paper presents a three-dimensional finite element method (FEM) model of horizontal Hall sensor in COMSOL Multiphysics. The model aims to simulate the sensor’s performance in a straightforward way and provides a means to simulate more complex applications with other physics modules. Compared with traditional two-dimensional models, the three-dimensional model is more flexible in designing Hall sensor and shows great significance in verifying the performance of sensors with different materials and geometries. By changing model parameters and comparing simulation results, an optimal design solution can be achieved effectively and economically. The presented Hall sensor achieves a sensitivity of 0.0669 V/(VT). Basic circuit modules of a complete sensor system are also introduced.

Item Type:Conference Proceedings
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Heidari, Dr Hadi
Authors: Fan, H., Li, S., Cen, Y., Feng, Q., and Heidari, H.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
ISSN:1558-3899
ISBN:9781728180588
Copyright Holders:Copyright © 2020 IEEE
First Published:First published in 2020 IEEE 63rd International Midwest Symposium on Circuits and Systems (MWSCAS)
Publisher Policy:Reproduced in accordance with the publisher copyright policy
Related URLs:

University Staff: Request a correction | Enlighten Editors: Update this record