Neural Microprobe Device Modelling for Implant Micromotions Failure Mitigation

Nabaei, V. , Panuccio, G. and Heidari, H. (2020) Neural Microprobe Device Modelling for Implant Micromotions Failure Mitigation. In: 2020 IEEE International Symposium on Circuits and Systems, Seville, Spain, 17-20 May 2020, ISBN 9781728133201 (doi:10.1109/ISCAS45731.2020.9180497)

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Brain micromotion is a major contributor to the failure of implantable neural interfaces. Brain micromotions and tissue damage can be effectively reduced in two ways: (i) miniaturization of the implantable device footprint and (ii) choosing flexible materials for the device substrate. To meet these requirements, in this work we perform two sets of modelling using finite element method in COMSOL Multiphysics. First, we model the performance of different materials ranging from stiff (e.g. Silicon) to very soft (e.g. PDMS) with different sizes to find the optimal dimension and material for the microprobe. For the device size optimization, the main degree of freedom is thickness, while the minimum shank width and length depend on the recording sites and the target recording point, respectively. Modelling devices with different thicknesses (50 − 200 μm) and fixed shank width (100 μm) based on different substrates, we show that the Polyimide-based microprobe exhibits a safety factor of 5 to 15 and maximum von mises stress of 248–770 MPa. Further, simulations indicate that the Polyimide-based microprobe of 50 μm thickness, exhibiting safety factor of 5 and stress of 248 MPa, provides the optimal solution in terms of size and material. Second, to analyse the device shape factor, we model different layouts based on the obtained optimal design and find that the optimal layout features von mises stress of 134.123 MPa, which is versatile and suitable to be used as microprobe especially for the brain micromotion effects mitigation purpose.

Item Type:Conference Proceedings
Glasgow Author(s) Enlighten ID:Nabaei, Dr Vahid and Heidari, Dr Hadi
Authors: Nabaei, V., Panuccio, G., and Heidari, H.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Copyright Holders:Crown Copyright © 2020
Publisher Policy:Reproduced in accordance with the copyright policy of the publisher

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
303466HERMESHadi HeidariEuropean Commission (EC)824164ENG - Electronics & Nanoscale Engineering