Hybrid FIB milling strategy for the fabrication of plasmonic nanostructures on semiconductor substrates

Einsle, J. F. F. , Bouillard, J.-S., Dickson, W. and Zayats, A. V. (2011) Hybrid FIB milling strategy for the fabrication of plasmonic nanostructures on semiconductor substrates. Nanoscale Research Letters, 6(1), 572. (doi: 10.1186/1556-276X-6-572) (PMID:22040004) (PMCID:PMC3234295)

Abstract

The optical properties of plasmonic semiconductor devices fabricated by focused ion beam (FIB) milling deteriorate because of the amorphisation of the semiconductor substrate. This study explores the effects of combining traditional 30 kV FIB milling with 5 kV FIB patterning to minimise the semiconductor damage and at the same time maintain high spatial resolution. The use of reduced acceleration voltages is shown to reduce the damage from higher energy ions on the example of fabrication of plasmonic crystals on semiconductor substrates leading to 7-fold increase in transmission. This effect is important for focused-ion beam fabrication of plasmonic structures integrated with photodetectors, light-emitting diodes and semiconductor lasers.

• Item Type: Articles
• Status: Published
• Refereed: Yes
• Glasgow Author(s) Enlighten ID: Einsle, Dr Joshua Franz
• Authors: Einsle, J. F. F., Bouillard, J.-S., Dickson, W., and Zayats, A. V.
• College/School: College of Science and Engineering > School of Geographical and Earth Sciences > Earth Sciences
• Journal Name: Nanoscale Research Letters
• Publisher: Springer
• ISSN: 1931-7573
• ISSN (Online): 1556-276X
• Copyright Holders: Copyright © 2011 Einsle et al.
• First Published: First published in Nanoscale Research Letters 6(1):572
• Publisher Policy: Reproduced under a Creative Commons License