Thick film hydrogen silsesquioxane planarization for passive component technology associated with electronic-photonic integrated circuits

Al-Moathin, A., Hou, L. , Ofiare, A., Wang, J., Ye, S. , Li, C. and Marsh, J. H. (2019) Thick film hydrogen silsesquioxane planarization for passive component technology associated with electronic-photonic integrated circuits. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 37(6), 061210. (doi: 10.1116/1.5123286)

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Abstract

Migrating electronic-photonic integrated circuits (EPICs) to higher data rates requires efficient electrical interfaces. This can be achieved with microwave technologies such as coplanar and microstrip transmission lines, but these can be difficult to apply in EPICs because of the complexity of the fabrication processes associated with monolithic integration. In this work, the authors report a novel method for planarizing a thick, low-κ film based on multiple-spins of layers of hydrogen silsesquioxane without a need for thermal curing. Films of total thicknesses of 5 and 6μm were planarized on a heavily doped InP substrate and used to realize coplanar waveguide transmission lines. The film shape is defined as an integral part of the fabrication process without any need for etching. A coplanar waveguide with a characteristic impedance of between 48 and 56Ω over the frequency range 10 MHz–67 GHz was demonstrated.

Item Type:Articles
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Wang, Dr Jue and Hou, Dr Lianping and Marsh, Professor John and Li, Dr Chong and Ofiare, Dr Afesomeh and Al-Moathin, Mr Ali and Ye, Dr Shengwei
Authors: Al-Moathin, A., Hou, L., Ofiare, A., Wang, J., Ye, S., Li, C., and Marsh, J. H.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Publisher:AIP Publishing
ISSN:2166-2746
ISSN (Online):2166-2754
Published Online:12 November 2019
Copyright Holders:Copyright © 2019 The Authors
First Published:First published in Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures 37(6): 061210
Publisher Policy:Reproduced in accordance with the publisher copyright policy

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
172610External engagement manager: CDT Photonic Integration for Advanced Data StorageJohn MarshEngineering and Physical Sciences Research Council (EPSRC)EP/L015323/1ENG - Electronics & Nanoscale Engineering