Nassar, H., Pullanchiyodan, A., Bhattacharjee, M. and Dahiya, R. (2019) 3D Printed Interconnects on Bendable Substrates for 3D Circuits. In: 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Glasgow, UK, 08-10 Jul 2019, ISBN 9781538693049 (doi: 10.1109/FLEPS.2019.8792234)
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Abstract
3D printing systems are expanding to realising fully embedded, multi-purpose, out-of-plane circuits. It is possible to utilise the characteristics of 3D printing to produce customisable, complex and bendable 3D structures and sensors that go beyond the use of standard polymer materials used with the current technology. With multi-material 3D printing, the additive manufacturing could be advanced to produce fully embedded sensors and electronic systems that cannot be otherwise produced in a one-step automated process. Our goals are concentrated towards embedding sensing circuits into next generation prosthetics and robotic arms for more advanced and smoother operation. These devices, along with other similar interests such as healthcare wearable devices, will inevitably include moving parts. Therefore, the embedded printed connections and readout circuits should withstand the repeatable bending of the robotic phalanges or sensing devices without degrading in performance or showing any cracks.
| Item Type: | Conference Proceedings |
|---|---|
| Additional Information: | Also funded by Royal Society-SERB Newton International Fellowship (NIF\R1\182437) and the European Commission through North West Centre for Advanced Manufacturing (H2020-Intereg-IVA5055). |
| Status: | Published |
| Refereed: | Yes |
| Glasgow Author(s) Enlighten ID: | Pullanchiyodan, Dr Abhilash and Bhattacharjee, Mr Mitradip and Dahiya, Professor Ravinder and Nassar, Mr Habib |
| Authors: | Nassar, H., Pullanchiyodan, A., Bhattacharjee, M., and Dahiya, R. |
| College/School: | College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering |
| ISBN: | 9781538693049 |
| Copyright Holders: | Copyright © 2019 IEEE |
| Publisher Policy: | Reproduced in accordance with the copyright policy of the publisher |
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