Large area soft e-skin: the challenges beyond sensor designs

Dahiya, R. , Yogeswaran, N., Liu, F., Manjakkal, L. , Burdet, E., Hayward, V. and Jorntell, H. (2019) Large area soft e-skin: the challenges beyond sensor designs. Proceedings of the IEEE, 107(10), pp. 2016-2033. (doi:10.1109/JPROC.2019.2941366)

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Abstract

Sensory feedback from touch is critical for many tasks carried out by robots and humans, such as grasping objects or identifying materials. Electronic skin (e-skin) is a crucial technology for these purposes. Artificial tactile skin that can play the roles of human skin remains a distant possibility because of hard issues in resilience, manufacturing, mechanics, sensorics, electronics, energetics, information processing, and transport. Taken together, these issues make it difficult to bestow robots, or prosthetic devices, with effective tactile skins. Nonetheless, progress over the past few years in relation with the above issues has been encouraging, and we have achieved close to providing some of the abilities of biological skin with the advent of deformable sensors and flexible electronics. The naive imitation of skin morphology and sensing an impoverished set of mechanical and thermal quantities are not sufficient. There is a need to find more efficient ways to extract tactile information from mechanical contact than those previously available. Renewed interest in neuromorphic tactile skin is expected to bring some fresh ideas in this field. This article reviews these new developments, particularly related to the handling of tactile data, energy autonomy, and large-area manufacturing. The challenges in relation with these advances for tactile sensing and haptics in robotics and prosthetics are discussed along with potential solutions.

Item Type:Articles
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Yogeswaran, Mr Nivasan and Dahiya, Professor Ravinder and Liu, Mr Fengyuan and Manjakkal, Dr Libu
Authors: Dahiya, R., Yogeswaran, N., Liu, F., Manjakkal, L., Burdet, E., Hayward, V., and Jorntell, H.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:Proceedings of the IEEE
Publisher:IEEE
ISSN:0018-9219
ISSN (Online):1558-2256
Published Online:03 October 2019
Copyright Holders:Copyright © 2019 IEEE
First Published:First published in Proceedings of the IEEE 107(10):2016-2033
Publisher Policy:Reproduced under a Creative Commons license

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
663861Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering and Physical Sciences Research Council (EPSRC)EP/M002527/1ENG - ENGINEERING ELECTRONICS & NANO ENG
3017280Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering and Physical Sciences Research Council (EPSRC)EP/R029644/1ENG - Electronics & Nanoscale Engineering
3042370Predictive Haptic COding Devices In Next Generation interfacesRavinder DahiyaEuropean Commission (EC)829186ENG - Electronics & Nanoscale Engineering

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