High-luminance and high-efficiency multi-chip light-emitting diode array packaging platform with nanoscale anodized aluminum oxide on silicon substrate

Wang, C., Cho, S.-J. and Kim, N.-Y. (2014) High-luminance and high-efficiency multi-chip light-emitting diode array packaging platform with nanoscale anodized aluminum oxide on silicon substrate. Thin Solid Films, 557, pp. 346-350. (doi: 10.1016/j.tsf.2013.11.019)

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Abstract

A silicon-based packaging platform is developed for the packaging component of a high-luminosity and highefficiency multi-chip light-emitting diode (LED) module, which is patterned on an insulating layer that consists of a nanoporous anodized aluminum oxide (AAO) layer and silicon dioxide (SiO2) deposited by plasma-enhanced chemical vapor deposition on a doped silicon substrate. Compared to a single thick layer of SiO2 on a conductive silicon substrate, the proposed substrate (SiO2/AAO/Si) was proven to be effective in terms of its abilities to reduce the insertion loss and to increase thermal conduction. The proposed structure can be used to effectively improve the reliability and reduce the thermal fatigue of high-luminance and high-efficiency LED array modules. We demonstrate an 8 W, cool-white (5700 K) LED array with a chip size of 570 μm × 550 μm, exhibiting a luminous intensity of 100 lm/W and a color rendering index of more than 83 at the forward current and voltage of 610 mA and 16.1 V, respectively.

Item Type:Articles
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Cho, Dr Sung-Jin
Authors: Wang, C., Cho, S.-J., and Kim, N.-Y.
Subjects:T Technology > TK Electrical engineering. Electronics Nuclear engineering
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:Thin Solid Films
Publisher:Elsevier
ISSN:0040-6090
ISSN (Online):1879-2731
Published Online:19 November 2013

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