Atomic layer etch processes developed in an ICP/RIE etching system for etching III-V compound semiconductor materials

Li, X. et al. (2017) Atomic layer etch processes developed in an ICP/RIE etching system for etching III-V compound semiconductor materials. AVS 17th International Conference on Atomic Layer Deposition (ALD 2017) featuring the 4th International Atomic Layer Etching Workshop (ALE 2017), Denver, CO, USA, 15-18 Jul 2017.

Li, X. et al. (2017) Atomic layer etch processes developed in an ICP/RIE etching system for etching III-V compound semiconductor materials. AVS 17th International Conference on Atomic Layer Deposition (ALD 2017) featuring the 4th International Atomic Layer Etching Workshop (ALE 2017), Denver, CO, USA, 15-18 Jul 2017.

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Abstract

No abstract available.

Item Type:Conference or Workshop Item
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Fu, Mr Yen-Chun and Li, Dr Xu and Cho, Dr Sungjin and Thayne, Professor Iain and Smith, Dr Matthew and Moran, Dr David and Hemakumara, Miss Dilini and Floros, Mr Konstantinos and Peralagu, Mr Uthayasankaran
Authors: Li, X., Fu, Y.-C., Peralagu, S., Cho, S., Floros, K., Hemakumara, D., Smith, M., Guiney, I., Moran, D., Humphreys, C., and Thayne, I.G.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
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