Flexible RFID Patch for Food Spoilage Monitoring

Yuan, M., Ghannam, R. , Karadimas, P. and Heidari, H. (2019) Flexible RFID Patch for Food Spoilage Monitoring. In: IEEE Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics (PrimeAsia 2018), Chengdu, China, 26-30 Oct 2018, pp. 68-71. ISBN 9781538695913 (doi:10.1109/PRIMEASIA.2018.8598134)

Yuan, M., Ghannam, R. , Karadimas, P. and Heidari, H. (2019) Flexible RFID Patch for Food Spoilage Monitoring. In: IEEE Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics (PrimeAsia 2018), Chengdu, China, 26-30 Oct 2018, pp. 68-71. ISBN 9781538695913 (doi:10.1109/PRIMEASIA.2018.8598134)

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Abstract

When food is reversed under an inappropriate situation, for example inadequate temperature, foodstuff would turn rotten as a result of the rapid breed of food spoilage bacteria under warm and wet circumstances where bacteria can be easily generated, the consequences can be worse if human beings eat those degenerative comestible, we might get bromatoxism. This paper focuses on the designing and simulation of a wearable radio frequency identification (RFID) patch for food spoilage monitoring with smart packaging that can be recognized and read temperature information by device supporting near field communication (NFC) technology through an attached circular antenna. More precisely, this patch can be read under a designed high frequency of 13.56MHz, and data is transmitted from the chip MLX90129 with its internal sensor that sends the temperature to the reader module.

Item Type:Conference Proceedings
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Ghannam, Dr Rami and Heidari, Dr Hadi and Karadimas, Dr Petros
Authors: Yuan, M., Ghannam, R., Karadimas, P., and Heidari, H.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
College of Science and Engineering > School of Engineering > Systems Power and Energy
ISSN:2159-2160
ISBN:9781538695913
Published Online:03 January 2019
Copyright Holders:Copyright © 2018 IEEE
First Published:First published in IEEE Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics (PrimeAsia 2018): 68-71
Publisher Policy:Reproduced in accordance with the publisher copyright policy
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