Cummins, G., Gao, J., Watson, D. E., Desmulliez, M. P. Y., McPhillips, R. and Cochran, S. (2017) Optimization and Characterisation of Bonding of Piezoelectric Transducers Using Anisotropic Conductive Adhesive. In: 2017 IEEE International Ultrasonics Symposium (IUS), Washington, D.C., USA, 6-9 Sept 2017, ISBN 9781538633830 (doi: 10.1109/ULTSYM.2017.8092778)
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Abstract
Bonding technology using anisotropic conductive paste shows great promise to achieve the denser integration schemes that are required for the application of high resolution ultrasonic imaging. A design of experiments has been carried out to characterize and optimize a flip-chip bonding technology that utilizes a novel, magnetically aligned anisotropic conductive paste. This optimized process has the potential to implement more reliable and electrically conductive, fine pitch bonding for the production of high density ultrasound transducer arrays in needle devices.
Item Type: | Conference Proceedings |
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Status: | Published |
Refereed: | Yes |
Glasgow Author(s) Enlighten ID: | Cochran, Professor Sandy and McPhillips, Miss Rachael |
Authors: | Cummins, G., Gao, J., Watson, D. E., Desmulliez, M. P. Y., McPhillips, R., and Cochran, S. |
College/School: | College of Science and Engineering > School of Engineering > Systems Power and Energy |
ISSN: | 1948-5727 |
ISBN: | 9781538633830 |
Published Online: | 02 November 2017 |
Copyright Holders: | Copyright © 2017 IEEE |
First Published: | First published in 2017 IEEE International Ultrasonics Symposium (IUS) |
Publisher Policy: | Reproduced in accordance with the publisher copyright policy |
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