Sharp, G. et al. (2017) Integration Technologies for Complex Photonic Circuits. In: 8th International Conference on Metamaterials, Photonic Crystals and Plasmonics (META '17), Seoul, South Korea, 25-28 Jul 2017,
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155062.pdf - Accepted Version 822kB |
Abstract
Future photonic integrated chips for quantum experiments will demand several thousand of components and a number of diverse functionalities integrated on the same chip. We will discuss some of the challenges faced by the up-scaling of photonic integrated chips with a particular emphasis on robust component trimming and heterogeneous integration of III-V devices on a silicon-on-insulator platform.
| Item Type: | Conference Proceedings |
|---|---|
| Status: | Published |
| Refereed: | No |
| Glasgow Author(s) Enlighten ID: | Klitis, Dr Charalambos and Sorel, Professor Marc and Song, Yifeng and Di Gaetano, Dr Eugenio and Biryukova, Vera and May, Mr Stuart and Sharp, Mr Graham and Reza, Mr Manuel and Strain, Dr Michael and Holmes, Dr Barry |
| Authors: | Sharp, G., Song, Y., Klitis, C., Biryukova, V., May, S., McPhillimy, J., Reza, M., Di Gaetano, E., Holmes, B., Strain, M., and Sorel, M. |
| Subjects: | Q Science > Q Science (General) Q Science > QC Physics |
| College/School: | College of Science and Engineering > School of Engineering College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering |
| Copyright Holders: | Copyright © 2017 The Authors |
| Publisher Policy: | Reproduced with the permission of the publisher. |
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