Waghmare, P. C., Patil, S. B. , Kumbhar, A., Dusane, R.O. and Rao, V.R. (2002) Ultra-thin silicon nitride by hot wire chemical vapor deposition (HWCVD) for deep sub-micron CMOS technologies. Microelectronic Engineering, 61-62, pp. 625-629. (doi: 10.1016/S0167-9317(02)00575-0)
Full text not currently available from Enlighten.
Abstract
Silicon nitride is considered a promising candidate to replace thermal oxide dielectrics, as the latter is reaching its scaling limits due to the excessive increase in the gate tunneling leakage current. The novel hot wire chemical vapor deposition (HWCVD) technique shows promise for gate quality silicon nitride film yields at 250 °C while maintaining their primary advantage of a higher dielectric constant of 7.1. In this paper we report the results of our efforts towards developing ultra-thin HWCVD silicon nitride as an advanced gate dielectric for the replacement of thermal gate oxides in future generations of ultra large scale integration (ULSI) devices.
Item Type: | Articles |
---|---|
Status: | Published |
Refereed: | Yes |
Glasgow Author(s) Enlighten ID: | Patil, Dr Samadhan |
Authors: | Waghmare, P. C., Patil, S. B., Kumbhar, A., Dusane, R.O., and Rao, V.R. |
College/School: | College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering |
Journal Name: | Microelectronic Engineering |
Publisher: | Elsevier |
ISSN: | 0167-9317 |
ISSN (Online): | 1873-5568 |
Published Online: | 22 March 2002 |
University Staff: Request a correction | Enlighten Editors: Update this record