Ultra-thin silicon nitride by hot wire chemical vapor deposition (HWCVD) for deep sub-micron CMOS technologies

Waghmare, P. C., Patil, S. B. , Kumbhar, A., Dusane, R.O. and Rao, V.R. (2002) Ultra-thin silicon nitride by hot wire chemical vapor deposition (HWCVD) for deep sub-micron CMOS technologies. Microelectronic Engineering, 61-62, pp. 625-629. (doi:10.1016/S0167-9317(02)00575-0)

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Abstract

Silicon nitride is considered a promising candidate to replace thermal oxide dielectrics, as the latter is reaching its scaling limits due to the excessive increase in the gate tunneling leakage current. The novel hot wire chemical vapor deposition (HWCVD) technique shows promise for gate quality silicon nitride film yields at 250 °C while maintaining their primary advantage of a higher dielectric constant of 7.1. In this paper we report the results of our efforts towards developing ultra-thin HWCVD silicon nitride as an advanced gate dielectric for the replacement of thermal gate oxides in future generations of ultra large scale integration (ULSI) devices.

Item Type:Articles
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Patil, Dr Samadhan
Authors: Waghmare, P. C., Patil, S. B., Kumbhar, A., Dusane, R.O., and Rao, V.R.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:Microelectronic Engineering
Publisher:Elsevier
ISSN:0167-9317
ISSN (Online):1873-5568
Published Online:22 March 2002

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