Surface micromachining of a thin film microresonator using dry decomposition of a polymer sacrificial layer

Patil, S.B. , Chu, V. and Conde, J. P. (2007) Surface micromachining of a thin film microresonator using dry decomposition of a polymer sacrificial layer. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 25(2), 455. (doi:10.1116/1.2715972)

Full text not currently available from Enlighten.

Abstract

Fabrication of thin film silicon bridge microresonators on glass substrates using an unzipping sacrificial polymer has been demonstrated. Polynorbornene, which can be thermally decomposed at ∼425°C∼425°C, has been used as the sacrificial layer, allowing a simple, fully dry sacrificial layer removal. The polynorbornene is spin coated onto the substrate and patterned by photolithography. A thin film silicon structural layer is deposited by rf plasma-enhanced chemical vapor deposition and patterned to form a microbridge. The microbridges are electrostatically actuated and the resulting deflection is measured optically. The fabricated microbridges show resonance frequencies of the order of ∼4.4MHz∼4.4MHz and quality factors ∼450∼450.

Item Type:Articles
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Patil, Dr Samadhan
Authors: Patil, S.B., Chu, V., and Conde, J. P.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Publisher:AIP Publishing
ISSN:1071-1023
ISSN (Online):1520-8567
Published Online:26 March 2007

University Staff: Request a correction | Enlighten Editors: Update this record