Hybrid Structure of Stretchable Interconnect for Reliable E-skin Application

Dang, W., Lorenzelli, L., Vinciguerra, V. and Dahiya, R. (2017) Hybrid Structure of Stretchable Interconnect for Reliable E-skin Application. In: 2017 IEEE 26th International Symposium on Industrial Electronics, Edinburgh, UK, 19-21 Jun 2017, pp. 2093-2096. ISBN 9781509014125 (doi:10.1109/ISIE.2017.8001579)

Dang, W., Lorenzelli, L., Vinciguerra, V. and Dahiya, R. (2017) Hybrid Structure of Stretchable Interconnect for Reliable E-skin Application. In: 2017 IEEE 26th International Symposium on Industrial Electronics, Edinburgh, UK, 19-21 Jun 2017, pp. 2093-2096. ISBN 9781509014125 (doi:10.1109/ISIE.2017.8001579)

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Abstract

This paper presents the methodology for realisation of stretchable interconnects based on hybrid thin film stack of spray-coated conductive polymer PEDOT: PSS and evaporated gold (Au) film. The PEDOT: PSS film, with its properties in electrical conductivity and mechanical softness, serves as a stress release buffer in the layered hybrid structure. With the serpentine-shape design, the stretchable interconnects can accommodate larger deformation in comparison with a straight line. The correlation between interconnects' morphology (i.e. cracks propagation) with their electrical behaviour has been studied through microscope in along with electrical characterisation under external strain. Furthermore, a comparison in failure strain among different serpentine-shaped designs has been studied. Higher level in stretchability of interconnects can be achieved with a larger arc degree in design. The fabricated stretchable interconnects can accommodate significant deformations up to 72% external strain while maintaining electrically conductive.

Item Type:Conference Proceedings
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Dang, Ms Wenting and Dahiya, Professor Ravinder
Authors: Dang, W., Lorenzelli, L., Vinciguerra, V., and Dahiya, R.
College/School:College of Science and Engineering > School of Engineering
College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
ISSN:2163-5145
ISBN:9781509014125
Published Online:08 August 2017
Copyright Holders:Copyright © 2017 IEEE
Publisher Policy:Reproduced in accordance with the copyright policy of the publisher

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
682141CONTESTRavinder DahiyaEuropean Commission (EC)317488ENG - ENGINEERING ELECTRONICS & NANO ENG
663861Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering and Physical Sciences Research Council (EPSRC)EP/M002527/1ENG - ENGINEERING ELECTRONICS & NANO ENG