Possibilities of Fabricating Copper-based RFID Tags with Photonic-sintered Inkjet Printing and Thermal Transfer Printing

Rizwan, M., Adhur Kuttty, A., Kgwadi, M., Drysdale, T. D., Sydanheimo, L., Ukkonen, L. and Virkki, J. (2017) Possibilities of Fabricating Copper-based RFID Tags with Photonic-sintered Inkjet Printing and Thermal Transfer Printing. IEEE Antennas and Wireless Propagation Letters, 16, pp. 1828-1831. (doi: 10.1109/LAWP.2017.2682319)

Abstract

This letter studies the possibilities of manufacturing copper-based passive ultrahigh frequency (UHF) radio frequency identification (RFID) tags using inkjet and thermal printing on two substrate materials, polyimide (Kapton), and a polyester-based substrate (Flexcon THERMLfilm). Both printing methods are tested to fabricate different tag designs, and the performance of successfully printed tags is evaluated using wireless measurements. Measurement results show that both printing methods, while using copper material, can be used to effectively fabricate passive UHF RFID tag antennas on selected substrates.

• Item Type: Articles (Letter)
• Status: Published
• Refereed: Yes
• Glasgow Author(s) Enlighten ID: Drysdale, Dr Timothy and Kgwadi, Monageng
• Authors: Rizwan, M., Adhur Kuttty, A., Kgwadi, M., Drysdale, T. D., Sydanheimo, L., Ukkonen, L., and Virkki, J.
• College/School: College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
• Journal Name: IEEE Antennas and Wireless Propagation Letters
• Publisher: IEEE
• ISSN: 1536-1225
• ISSN (Online): 1548-5757
• Published Online: 15 March 2017
• Copyright Holders: Copyright © 2017 IEEE
• First Published: First published in IEEE Antennas and Wireless Propagation Letters 16: 1828-1831
• Publisher Policy: Reproduced in accordance with the publisher copyright policy