Antenna and Heat Sink

ITI Scotland Ltd. (2006) Antenna and Heat Sink. .

Full text not currently available from Enlighten.

Publisher's URL: https://worldwide.espacenet.com/publicationDetails/biblio?DB=EPODOC&II=0&ND=3&adjacent=true&locale=en_EP&FT=D&date=20080206&CC=GB&NR=2440570A&KC=A

Abstract

An antenna 2 is used both as an RF radiator and as a heat sink. A device, such as an integrated circuit package 12, that generates unwanted heat may comprise an antenna and heatsink 2 placed in thermal contact with it. The antenna may be electrically connected to a component 12 either by one or more pins 14 or by capacitive coupling plates (fig 5 16,18), and may be attached by heat-sinking paste or adhesive. The antenna 2 may comprise: a two or three dimensional structure; a meander-line structure; and fins (fig 3, 33-37) of different lengths. The antenna may be used for an ultra-wideband wireless device in the frequency range 3 to 10 GHz, and for communications between such devices as computers, disc drives, printers, scanners, televisions, speakers PDAs, cameras and mobile phones.

Item Type:Patents
Additional Information:
Application Number GB00615148.4

Publication Number GB2440570.

Inventors: Mark Norris, Neil Williams, Michael Phillippakis, Duncan Bremner, Dean Kemp, David Daniels.
Status:Published
Glasgow Author(s) Enlighten ID:Bremner, Dr Duncan
Authors: Bremner, D.
College/School:College of Science and Engineering > School of Engineering

University Staff: Request a correction | Enlighten Editors: Update this record