Effects of Humidity on the Electro-Optical-Thermal Characteristics of High-Power LEDs

Law, T.K., Lim, F. , Li, Y. , Teo, J.W. R. and Wei, S. (2017) Effects of Humidity on the Electro-Optical-Thermal Characteristics of High-Power LEDs. In: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), Singapore, 30 Nov - 03 Dec 2016, pp. 718-723. ISBN 9781509043705 (doi:10.1109/EPTC.2016.7861576)

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Abstract

LEDs are subjected to environments with high moisture in many applications. In this paper, the experiments reveal photometric and colorimetric degradation at high humidity. Corresponding spectral power analysis and parameter extraction indicate that the flip-chip bonded LED samples show accelerated chip failure compared to the conventionally bonded samples. The chip-related failure induces greater heat accumulation, which correlates with the increase in heating power observed in the package. However, the temperature rise and thermal resistance for the flip-chip bonded LEDs do not increase substantially as compared to the conventionally bonded LEDs. This is because the junction temperature can be reduced with a flip-chip die-bonding configuration where the heat generated in the LED chip is dissipated effectively onto the AlN substrate, thereby reducing the increase in temperature rise and thermal resistance. The experimental results are supported by evaluation of the derivative structure functions. In addition, as the thermal resistance of the LED package varies with different humidity levels, there is a need to specify the conditions of humidity in data sheets as LED manufacturers routinely specify a universal thermal resistance value under a fixed operating condition.

Item Type:Conference Proceedings
Keywords:Electro-optical devices, flip-chip devices, humidity, light emitting diodes, microassembling, thermal resistance, aln, led, colorimetric degradation, die-bonding, electro-optical-thermal characteristics, flip-chip, heating power, humidity effect, parameter extraction, photometric degradation, spectral power analysis, temperature rise, thermal resistance, flip-chip devices, heating, humidity, light emitting diodes, temperature measurement, thermal resistance.
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Law, Thong Kok and Lim, Dr Fannon and Li, Professor Yun
Authors: Law, T.K., Lim, F., Li, Y., Teo, J.W. R., and Wei, S.
College/School:College of Science and Engineering > School of Engineering
College of Science and Engineering > School of Engineering > Systems Power and Energy
ISBN:9781509043705
Copyright Holders:Copyright © 2016 IEEE
First Published:First published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC): 718-723
Publisher Policy:Reproduced in accordance with the publisher copyright policy

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