Gupta, S., Giacomozzi, F., Heidari, H. , Lorenzelli, L. and Dahiya, R. (2016) Ultra-thin silicon based piezoelectric capacitive tactile sensor. Procedia Engineering, 168, pp. 662-665. (doi: 10.1016/j.proeng.2016.11.242)
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Abstract
This paper presents an ultra-thin bendable silicon based tactile sensor, in a piezoelectric capacitor configuration, realized by wet anisotropic etching as post-processing steps. The device is fabricated over bulk silicon, which is thinned down to 35 μm from an original thickness of 636 μm. Dicing of thin membrane is achieved by low cost novel technique of Dicing before Etching. The piezoelectric capacitor is composed of polyvinylidene fluoride trifluoroethylene (PVDF-TrFE), which present an attractive avenue for tactile sensing as they respond to dynamic contact events (which is critical for robotic tasks), easy to fabricate at low cost and are inherently flexible. The sensor exhibits enhanced piezoelectric properties, thanks to the optimization of the poling procedure. The sensor capacitive behaviour is confirmed using impedance analysis and the electro-mechanical characterization is done using TIRA shaker setup.
Item Type: | Articles |
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Status: | Published |
Refereed: | Yes |
Glasgow Author(s) Enlighten ID: | Gupta, Mr Shoubhik and Dahiya, Professor Ravinder and Heidari, Professor Hadi |
Authors: | Gupta, S., Giacomozzi, F., Heidari, H., Lorenzelli, L., and Dahiya, R. |
College/School: | College of Science and Engineering > School of Engineering College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering |
Journal Name: | Procedia Engineering |
Publisher: | Elsevier |
ISSN: | 1877-7058 |
Copyright Holders: | Copyright © 2016 The Authors |
First Published: | First published in Procedia Engineering 168: 662-665 |
Publisher Policy: | Reproduced under a Creative Commons License |
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