Ultra-thin silicon based piezoelectric capacitive tactile sensor

Gupta, S., Giacomozzi, F., Heidari, H., Lorenzelli, L. and Dahiya, R. (2016) Ultra-thin silicon based piezoelectric capacitive tactile sensor. Procedia Engineering, 168, pp. 662-665. (doi:10.1016/j.proeng.2016.11.242)

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Abstract

This paper presents an ultra-thin bendable silicon based tactile sensor, in a piezoelectric capacitor configuration, realized by wet anisotropic etching as post-processing steps. The device is fabricated over bulk silicon, which is thinned down to 35 μm from an original thickness of 636 μm. Dicing of thin membrane is achieved by low cost novel technique of Dicing before Etching. The piezoelectric capacitor is composed of polyvinylidene fluoride trifluoroethylene (PVDF-TrFE), which present an attractive avenue for tactile sensing as they respond to dynamic contact events (which is critical for robotic tasks), easy to fabricate at low cost and are inherently flexible. The sensor exhibits enhanced piezoelectric properties, thanks to the optimization of the poling procedure. The sensor capacitive behaviour is confirmed using impedance analysis and the electro-mechanical characterization is done using TIRA shaker setup.

Item Type:Articles
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Heidari, Dr Hadi and Dahiya, Dr Ravinder and Gupta, Mr Shoubhik
Authors: Gupta, S., Giacomozzi, F., Heidari, H., Lorenzelli, L., and Dahiya, R.
College/School:College of Science and Engineering > School of Engineering
College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:Procedia Engineering
Publisher:Elsevier
ISSN:1877-7058
Copyright Holders:Copyright © 2016 The Authors
First Published:First published in Procedia Engineering 168: 662-665
Publisher Policy:Reproduced under a Creative Commons License

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
682141CONTESTRavinder DahiyaEuropean Commission (EC)317488ENG - ENGINEERING ELECTRONICS & NANO ENG
663861Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering & Physical Sciences Research Council (EPSRC)EP/M002527/1ENG - ENGINEERING ELECTRONICS & NANO ENG