Dang, W., Vinciguerra, V., Lorenzelli, L. and Dahiya, R. (2016) Metal-organic dual layer structure for stretchable interconnects. Procedia Engineering, 168, pp. 1559-1562. (doi: 10.1016/j.proeng.2016.11.460)
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Abstract
This paper reports a novel method for obtaining stretchable interconnects using gold and organic material (PEDOT:PSS) in a dual-layer structure on PDMS substrate. With an appropriate design and carefully carried out microfabrication steps, the structure was successfully patterned into serpentine shape and highly stretchable interconnects were obtained. The fabricated interconnects can be stretched up to 170% of their original length while retaining an adequate level of conductivity.
| Item Type: | Articles |
|---|---|
| Status: | Published |
| Refereed: | Yes |
| Glasgow Author(s) Enlighten ID: | Dahiya, Professor Ravinder and Dang, Ms Wenting |
| Authors: | Dang, W., Vinciguerra, V., Lorenzelli, L., and Dahiya, R. |
| College/School: | College of Science and Engineering > School of Engineering College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering |
| Journal Name: | Procedia Engineering |
| Publisher: | Elsevier |
| ISSN: | 1877-7058 |
| Copyright Holders: | Copyright © 2016 The Authors |
| First Published: | First published in Procedia Engineering 168: 1559-1562 |
| Publisher Policy: | Reproduced under a Creative Commons License |
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