Magnetoelectronics on Bendable Ultra-Thin Si Chips

Heidari, H., Liu, F. and Dahiya, R. (2017) Magnetoelectronics on Bendable Ultra-Thin Si Chips. innoLAE 2017 Conference, Cambridge, United Kingdom, 31 Jan - 01 Feb 2017.

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Abstract

The integration of magnetic elements into electronic devices, often referred to as magnetoelectronics, is an interesting development in flexible electronics. Here we present magentic devices (e.g. Hall Sensor and Giant Magnetoresistance (GMR)) on ultra-thin chips and our investigation realted to the effects of bending stress on these devices. The bending induced variations in device parameters are needed to improve device models and design the new generation of flexible magnetic sensors.

Item Type:Conference or Workshop Item
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Dahiya, Dr Ravinder and Heidari, Dr Hadi
Authors: Heidari, H., Liu, F., and Dahiya, R.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
659051Flexible Electronics Device Modelling (FLEXELDEMO)Ravinder DahiyaEngineering & Physical Sciences Research Council (EPSRC)EP/M002519/1ENG - ENGINEERING ELECTRONICS & NANO ENG
663861Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering & Physical Sciences Research Council (EPSRC)EP/M002527/1ENG - ENGINEERING ELECTRONICS & NANO ENG