Li, X. , Gay, D.L., McNeill, D.W., Armstrong, B.M. and Gamble, H.S. (1998) BESOI Using a Silicon Germanium Etch Stop. In: Fourth International Symposium on Semiconductor Wafer Bonding : Science, Technology, and Applications, Paris, France, 1997, pp. 313-320. ISBN 9781566771894
Full text not currently available from Enlighten.
Abstract
No abstract available.
Item Type: | Conference Proceedings |
---|---|
Status: | Published |
Refereed: | Yes |
Glasgow Author(s) Enlighten ID: | Li, Dr Xu |
Authors: | Li, X., Gay, D.L., McNeill, D.W., Armstrong, B.M., and Gamble, H.S. |
College/School: | College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering |
ISBN: | 9781566771894 |
University Staff: Request a correction | Enlighten Editors: Update this record