Szczęsny, R., Szłyk, E., Wiśniewski, M. A., Hoang, T. K. A. and Gregory, D. H. (2016) Facile preparation of copper nitride powders and nanostructured films. Journal of Materials Chemistry, 4(22), pp. 5031-5037. (doi: 10.1039/C6TC00493H)
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Abstract
The simple fluorinated precursor, copper(II) trifluoroacetate, Cu(CF3COO)2 can be effectively utilised in the synthesis of Copper(I) nitride, Cu3N, powders and films by combinations of wet processing and gas-solid (ammonolysis) techniques. The resulting materials were characterized by powder X-ray diffraction (PXD), scanning electron microscopy (SEM) with energy dispersive X-ray spectroscopy (EDX), atomic force microscopy (AFM), diffuse reflectance UV-visible spectroscopy (DRUV-Vis), Raman spectroscopy, infrared spectroscopy (IR), thermogravimetric-differential thermal analysis-mass spectrometry (TG-DTA-MS) and nitrogen adsorption (BET) analysis. Moreover, variable temperature IR (VT-IR) studies of the solid phase were performed in situ during ammonolysis. Single-phase Cu3N powders composed of sub-micron scale platelets can be produced over relatively short reaction times. Materials prepared in this way are stoichiometric narrow band gap semiconductors. The same trifluoroacetate precursor was used to prepare nanostructured nitride films by dip coating. The surface microstructure was investigated and evaluated relative to films deposited by spin coating and nebulisation using soluble carboxylate precursors.
Item Type: | Articles |
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Status: | Published |
Refereed: | Yes |
Glasgow Author(s) Enlighten ID: | Hoang, Dr Tuan and Szczesny, Dr Robert and Gregory, Professor Duncan |
Authors: | Szczęsny, R., Szłyk, E., Wiśniewski, M. A., Hoang, T. K. A., and Gregory, D. H. |
College/School: | College of Science and Engineering > School of Chemistry |
Journal Name: | Journal of Materials Chemistry |
Publisher: | Royal Society of Chemistry |
ISSN: | 0959-9428 |
ISSN (Online): | 1364-5501 |
Published Online: | 26 April 2016 |
Copyright Holders: | Copyright © 2016 The Royal Society of Chemistry |
First Published: | First published in Journal of Materials Chemistry 4(22): 5031-5037 |
Publisher Policy: | Reproduced under a Creative Commons License |
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