E-Skin Module with Heterogeneously Integrated Graphene Touch Sensors and CMOS Circuitry

Heidari, H. , Garcia Nunez, C. and Dahiya, R. (2017) E-Skin Module with Heterogeneously Integrated Graphene Touch Sensors and CMOS Circuitry. In: IEEE Sensors 2016, Orlando, USA, 30 Oct - 02 Nov 2016, ISBN 9781479982875 (doi:10.1109/ICSENS.2016.7808760)

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Abstract

This paper presents a flexible electronic skin (e-skin) module developed by heterogeneous integration of graphene based touch sensors and CMOS chips having basic capacitance-to-voltage converter (CVC) circuitry to acquire the sensor response. Graphene touch sensor was firstly transfer printed on a flexible polyvinyl chloride (PVC) substrate, thereafter the CMOS chip with 4×4 array of large transistors was integrated on the same PVC substrate. Then, resulting module was tested to verify the performance. The heterogeneous integration of graphene and Si based devices on the same flexible substrate is an interesting new approach that can be scaled up, opening a new opportunity for obtaining large area e-skin for robotic applications.

Item Type:Conference Proceedings
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Dahiya, Dr Ravinder and Garcia Nunez, Dr Carlos and Heidari, Dr Hadi
Authors: Heidari, H., Garcia Nunez, C., and Dahiya, R.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
ISBN:9781479982875
Copyright Holders:Copyright © 2016 IEEE
Publisher Policy:Reproduced in accordance with the copyright policy of the publisher

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
659051Flexible Electronics Device Modelling (FLEXELDEMO)Ravinder DahiyaEngineering & Physical Sciences Research Council (EPSRC)EP/M002519/1ENG - ENGINEERING ELECTRONICS & NANO ENG
663861Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering & Physical Sciences Research Council (EPSRC)EP/M002527/1ENG - ENGINEERING ELECTRONICS & NANO ENG