Simulation Scenarios of Ultra-Thin Chips in Smart Large-Area Flexible Electronics

Heidari, H. , Gupta, S. and Dahiya, R. (2016) Simulation Scenarios of Ultra-Thin Chips in Smart Large-Area Flexible Electronics. In: innoLAE 2016 Conference, Cambridge, England, 1-2 Feb 2016,

Full text not currently available from Enlighten.


Smart Large-Area Electronics (LAE) needs to be flexible and use high-performance computation front-end system. Despite all successes in flexible organic sensing devices, conventional CMOS ICs have efficient functionality for sensor interface circuits, communication, and embedded computation. Therefore, the architectures that combine LAE and CMOS ultra-thin ICs, can leverage the strengths of both technologies to enable sensing along with these functions. However, the most challenging part of this combination is prediction of the bending stress effects on bendable ICs. Because bending stress changes the transistor characteristics such as current-voltage or drain-current variation and threshold-voltage shift. Furthermore, the interconnections between two technology, of LAE and ultra-thin ICs to transfer analog and digital signals for computation processing is a key limitation. This issue is handled through contactless interfacing by using capacitive and inductive antennas.

Item Type:Conference Proceedings
Glasgow Author(s) Enlighten ID:Heidari, Dr Hadi and Dahiya, Professor Ravinder
Authors: Heidari, H., Gupta, S., and Dahiya, R.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Related URLs:

University Staff: Request a correction | Enlighten Editors: Update this record