Flexible FETs using ultrathin Si microwires embedded in solution processed dielectric and metal layers

Khan, S., Yogeswaran, N., Taube, W., Lorenzelli, L. and Dahiya, R. (2015) Flexible FETs using ultrathin Si microwires embedded in solution processed dielectric and metal layers. Journal of Micromechanics and Microengineering, 25(12), 125019. (doi:10.1088/0960-1317/25/12/125019)

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Abstract

This work presents a novel manufacturing route for obtaining high performance bendable field effect transistors (FET) by embedding silicon (Si) microwires (2.5 μm thick) in layers of solution-processed dielectric and metallic layers. The objective of this study is to explore heterogeneous integration of Si with polymers and to exploit the benefits of both microelectronics and printing technologies. Arrays of Si microwires are developed on silicon on insulator (SOI) wafers and transfer printed to polyimide (PI) substrate through a polydimethylsiloxane (PDMS) carrier stamp. Following the transfer printing of Si microwires, two different processing steps were developed to obtain top gate top contact and back gate top contact FETs. Electrical characterizations indicate devices having mobility as high as 117.5 cm2 V−1 s−1. The fabricated devices were also modeled using SILVACO Atlas. Simulation results show a trend in the electrical response similar to that of experimental results. In addition, a cyclic test was performed to demonstrate the reliability and mechanical robustness of the Si μ-wires on flexible substrates.

Item Type:Articles
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Yogeswaran, Mr Nivasan and Dahiya, Professor Ravinder
Authors: Khan, S., Yogeswaran, N., Taube, W., Lorenzelli, L., and Dahiya, R.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:Journal of Micromechanics and Microengineering
Publisher:IOP Publishing Ltd.
ISSN:0960-1317
ISSN (Online):1361-6439
Copyright Holders:Copyright © 2015 The Authors
First Published:First published in Journal of Micromechanics and Microengineering 25(12):125019
Publisher Policy:Reproduced under a Creative Commons License

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
663861Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering & Physical Sciences Research Council (EPSRC)EP/M002527/1ENG - ENGINEERING ELECTRONICS & NANO ENG
682141CONTESTRavinder DahiyaEuropean Commission (EC)317488ENG - ENGINEERING ELECTRONICS & NANO ENG