Silicate bonding properties: investigation through thermal conductivity measurements

Lorenzini, M. et al. (2010) Silicate bonding properties: investigation through thermal conductivity measurements. Journal of Physics: Conference Series, 228(1), 012019. (doi:10.1088/1742-6596/228/1/012019)

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Abstract

A direct approach to reduce the thermal noise contribution to the sensitivity limit of a GW interferometric detector is the cryogenic cooling of the mirrors and mirrors suspensions. Future generations of detectors are foreseen to implement this solution. Silicon has been proposed as a candidate material, thanks to its very low intrinsic loss angle at low temperatures and due to its very high thermal conductivity, allowing the heat deposited in the mirrors by high power lasers to be efficiently extracted. To accomplish such a scheme, both mirror masses and suspension elements must be made of silicon, then bonded together forming a quasi-monolithic stage. Elements can be assembled using hydroxide-catalysis silicate bonding, as for silica monolithic joints. The effect of Si to Si bonding on suspension thermal conductance has therefore to be experimentally studied. A measurement of the effect of silicate bonding on thermal conductance carried out on 1 inch thick silicon bonded samples, from room temperature down to 77 K, is reported. In the explored temperature range, the silicate bonding does not seem to affect in a relevant way the sample conductance.

Item Type:Articles
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Reid, Professor Stuart and van Veggel, Dr Marielle and Cagnoli, Dr Gianpietro and Rowan, Professor Sheila and Martin, Dr Iain and Hough, Professor James and Haughian, Dr Karen
Authors: Lorenzini, M., Cesarini, E., Cagnoli, G., Campagna, E., Haughian, K., Hough, J., Losurdo, G., Martelli, F., Martin, I., Piergiovanni, F., Reid, S., Rowan, S., van Veggel, A.A., and Vetrano, F.
College/School:College of Science and Engineering > School of Physics and Astronomy
Journal Name:Journal of Physics: Conference Series
Publisher:Institute of Physics Publishing Ltd.
ISSN:1742-6588
ISSN (Online):1742-6596

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