Flexible pressure sensors based on screen printed P(VDF-TrFE) and P(VDF-TrFE)/MWCNTs

Khan, S., Dang, W., Lorenzelli, L. and Dahiya, R. (2015) Flexible pressure sensors based on screen printed P(VDF-TrFE) and P(VDF-TrFE)/MWCNTs. IEEE Transactions on Semiconductor Manufacturing, 28(4), pp. 486-493. (doi:10.1109/TSM.2015.2468053)

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Abstract

This paper presents large-area-printed flexible pressure sensors developed with an all screen-printing technique. The 4×4 sensing arrays are obtained by printing Polyvinylidene Fluoride-Trifluoroethylene P(VDF-TrFE) and their nanocomposite with multi-walled carbon nanotubes (MWCNTs) and are sandwiched between printed metal electrodes in a parallel plate structure. The bottom electrodes and sensing materials are printed sequentially on polyimide (PI) and polyethylene terephthalate (PET) substrates. The top electrodes with force concentrator posts on backside are printed on a separate PET substrate and adhered with good alignment to the bottom electrodes. The interconnects, linking the sensors in series, are printed together with metal electrodes and they provide the expandability of the cells. Different weight ratios of MWCNTs are mixed in P(VDF-TrFE) to optimize the percolation threshold for a better sensitivity. The nanocomposite of MWCNTs in piezoelectric P(VDF-TrFE) is also explored for application in stretchable interconnects, where the higher conductivity at lower percolation ratios are of significant importance compared to the nanocomposite of MWCNTs in an insulator material. To examine the functionality and sensitivity of sensor module, the capacitancevoltage analysis at different frequencies, and the piezoelectric and piezoresistive response of the sensor are presented. The whole package of foldable pressure sensor is completely developed by screen-printing and is targeted towards realization of low-cost electronic skin.

Item Type:Articles
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Dahiya, Professor Ravinder
Authors: Khan, S., Dang, W., Lorenzelli, L., and Dahiya, R.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:IEEE Transactions on Semiconductor Manufacturing
Publisher:IEEE
ISSN:0894-6507
ISSN (Online):1558-2345
Copyright Holders:Copyright © 2015 IEEE
First Published:First published in IEEE Transactions on Semiconductor Manufacturing
Publisher Policy:Reproduced in accordance with the copyright policy of the publisher

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
663861Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering & Physical Sciences Research Council (EPSRC)EP/M002527/1ENG - ENGINEERING ELECTRONICS & NANO ENG
682141CONTESTRavinder DahiyaEuropean Commission (EC)317488ENG - ENGINEERING ELECTRONICS & NANO ENG