PDMS residues-free micro/macrostructures on flexible substrates

Dahiya, R. , Gottardi, G. and Laidani, N. (2015) PDMS residues-free micro/macrostructures on flexible substrates. Microelectronic Engineering, 136, pp. 57-62. (doi:10.1016/j.mee.2015.04.037)

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Abstract

Transfer printing has been reported recently as a viable route for electronics on flexible substrates. The method involves transferring micro-/macrostructures such as wires or ultra-thin chips from Si (silicon) wafers to the flexible substrates by using elastomeric transfer substrates such as poly(dimethylsiloxane) (PDMS). A major challenge in this process is posed by the residues of PDMS, which are left over on Si surface after the nanostructures have been transferred. As insulator, PDMS residues make it difficult to realize metal connections and hence pose challenge in the way of using nanostructures as the building blocks for active electronics. This paper presents a method for PDMS residues-free transfer of Si micro-/macrostructures to flexible substrates such as polyimide (PI). The PDMS residues are removed from Si surface by immersing the transferred structures in a solution of quaternary ammonium fluoride such as TBAF (Tetrabutylammonium Fluoride) and non-hydroxylic aprotic solvent such as PMA (propylene glycol methyl ether acetate). The residues are removed at a rate (∼1.5 μm/min) which is about five times faster than the traditional dry etch methods. Unlike traditional alternatives, the presented method removes PDMS without attacking the flexible PI substrates.

Item Type:Articles
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Dahiya, Professor Ravinder
Authors: Dahiya, R., Gottardi, G., and Laidani, N.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:Microelectronic Engineering
Publisher:Elsevier B.V.
ISSN:0167-9317
ISSN (Online):1873-5568
Copyright Holders:Copyright © 2015 The Authors
First Published:First published in Microelectronic Engineering 136:57-62
Publisher Policy:Reproduced under a Creative Commons License

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
663861Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering & Physical Sciences Research Council (EPSRC)EP/M002527/1ENG - ENGINEERING ELECTRONICS & NANO ENG
659051Flexible Electronics Device Modelling (FLEXELDEMO)Ravinder DahiyaEngineering & Physical Sciences Research Council (EPSRC)EP/M002519/1ENG - ENGINEERING ELECTRONICS & NANO ENG